Chip / Wire Bond Inspection
IV-4000 Series
Inspection of die and wire bonding on substrates or lead frames.
Product Details
- Dual gripper positioning enables faster transfer.
- High-resolution color camera & IAIS system.
- Dual magnification / dual-camera configuration.
- Supports 2D / 3D inspection.
- Multiple optical modules meet various inspection requirements.
- AI software supports continuous iterative upgrades.
- Supports programmable width adjustment
- to accommodate different types of lead frames.
- Customizable to meet special production requirements.
Technical Specifications
1 specs| System Enclosure Dimensions | 1600 x 1200 x 2000mm(WxDxH) |
