产品中心
探索我们为您精心打造的产品系列
IV-E1700
基板或引线框架产品的固晶和金铜铝线检查
芯片键合
引线键合
软件选项
摄像模块-爬胶高度
多层级用户管理
详细生产批次报告
劣品处理模块选项
系统外壳尺寸:
1600 x 1200 x 2000mm(WxDxH)
查看详情
芯片及引线键合检测
IV-T3300
Automated Die & Wire Bond Inspection Machine
颜色:
白色，红色，绿色
电压:
220v
大小:
220*100*200
查看详情
晶圆检测
IV-W2000
The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
System Housing Dimensions:
1400 x 1150 x 1540 mm (WxDxH)
查看详情
晶圆检测