Chip / Wire Bond Inspection
IV-E1700
Inspection of die bonding and gold/copper/aluminum wire bonding for substrates or lead frame products.
Product Details
- Various customized optical configurations
- Optical module configurations tailored to specific inspection requirements
- Replacing manual three-light inspection processes
- Three optional modules for defect/reject handling
- Integrated with production reports, statistics, images, Pareto charts, etc.
- Independently developed machines, core modules and software
- 2D or combined 2D & 3D automated visual inspection solutions
- Providing traceability and data analysis for FOL process improvement
- Automatic lead frame punch module, laser wire cutting module and ink dot marking module
Technical Specifications
1 specs| System Enclosure Dimensions | 1600 x 1200 x 2000mm(WxDxH) |
