Chip / Wire Bond Inspection
IV-5000 Series
Chip / Wire Bond Inspection – High-Speed Model
Product Details
- Easy to Operate | Multi-level authority management, one‑click start for fully automatic cassette inspection process
- Easy to Maintain | Innovative dual‑track design with lead frame jam detection function
- Highly Compatible | Combines high precision and high stability, greatly improving UPH
- Highly Customizable | 100% independently developed to deeply meet customized requirements
- High Speed | Flexible integration of multiple optical modules and dual cameras, real‑time flying vision, 3D inspection
Technical Specifications
1 specs| System Enclosure Dimensions | 1500×1300×1700mm(W×D×H) |
