IV-T3300 - 广州殷迪科技有限公司
Chip / Wire Bond Inspection

IV-T3300

Post Wire Bond & Die Bond Inspection Equipment

Product Details

Dual JEDEC Tray Feeding System

600×550mm Large Field-of-View Inspection Area

Tray replacement in only 5–7 seconds for high efficiency and convenience

Supports SMEMA Standard Inline Connection

Flexibly Adjustable Conveyor Width

Carrier QR Code Reading Function

Vacuum + CDA Air Blow Foreign Particle Removal Device

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